shape
Support for special-cut, drill hole(minimum aperture 0.8 mm)
Color
Different colors of silkprint and LOGO screen print(UV-proof ink optional)
Brand
Options: AGC,Corning, CG etc.
Thickness
Thickness option: 0.55, 0.7,1.0,1.1,1.8,2.0,3.0,4.0 ,5.0,6.0mm etc.
Sensor Features
Materials:Glass,fiilm,film+film
Thickness:0.005mm,0.125mm,0.4mm,0.55mm,0.7mm,1.1mm
FPC:shape design optional
IC:Cypress,Ilitek,Atmel,Focaltech,Goodix,EETI,etc
Interface:IIC,USB,SPI,RS232
Display
Partners: BOE, AUO, LNNOLux, TianMa, IVO, etc.
Category: TFT-LCD, OLED
Optical Bonding:OCA,OCR
Frame Adhension
Product Features
GLOVE FUNCTION
Support gloves made of various materials such as nylon,latex, cotton,plush and leather and of different thickness,6mm the thickest
WATER FUNCTION
Support touch with water,oil, oil-water mixture and brine
THICKNESS
Support normal touch with thick cover like tempered glass,15mmm the thickest
Cover glass surface treatment--AG, AR, AF
Anti Glare (AG) processing could eliminate screen surface mirror problem through converting direct light to diffuse light on the touch screen.
AR processing means adding a type of coating that could reduce reflected light on the cover glass,which dereases screen reflection and increases visual effects significantly in the sun.
AF processing is adding on the cover glass a king of coating that could increases surface smoothness, reduces surface sliding resistance , residual water and fingerprints on the surface significantly and improves feeling and clarity.
Module Assemble
Overall module joint processing
Spread the capacitance screen and display screen contact surface and use OCA or OCR to fit them into integrated module
ADVANTAGE
- Strengthen visual effect in the sun and the overall impact resistant performance of the product.
- Prolong the service life and broaden end product application environment
- Increase shock resistance and reduce the damage rate
Frame adhesion assembly processing
Use 3M adhesive to Joint periphery of the capacitance screen frame and display screen iron frame into integral module.
ADVANTAGE
Improve the production yield and lower module assemble cast effectively
Reduce material loss and facilitate structure design and assembly